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Proceedings Paper

Application of COTS high-speed 980-nm pump laser diode and driver for free-space laser communication terminal
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Paper Abstract

In our Photonics West 98 paper, we presented our study results on using commercially available 860 nm high power laser diodes and high-speed laser driver for free-space laser communication terminal application. We demonstrated the feasibility of a free space laser communication link using a junction-up 860 nm high power laser diode driven by a high current laser driver from Hytek Microsystems up to 622 Mb/s. Recent development in high speed InGaAs/GaAs strained layer quantum well (SLQW) laser at 980 nm has provided an additional design option for a laser communication terminal. The advantages of using the 980 nm laser are: (1) WDM market in the telecom industry has created a volume demand for the 980 nm pump lasers. The future cost of 980 nm lasers is expected to be lower due to the economy of scale. (2) In our previous publications, we have demonstrated CW operation of strained layer QW laser at temperature higher than 200 degree(s)C. There is a potential for this type of laser diode to operate in a much harsher and higher temperature environment, and (3) 980 nm pump laser has output power comparable to high power 860 nm laser diodes. In this paper, we will present the high data rate characteristics of a high-speed 980 nm (SLQW) pump laser. Using commercial-off-the-shelf laser drivers we will demonstrate the laser transmitter system characteristics from 622 Mb/s to 3 Gb/s. Detail experimental results on bit- error-rate measurement for a 980 nm device will be presented.

Paper Details

Date Published: 24 June 1999
PDF: 8 pages
Proc. SPIE 3708, Digital Wireless Communication, (24 June 1999); doi: 10.1117/12.351220
Show Author Affiliations
Eric Y. Chan, Boeing Phantom Works (United States)
Jeff C. Adams, Boeing Phantom Works (United States)
Jonathan M. Saint Clair, Boeing Phantom Works (United States)
Kenneth A. Morrison, Hytek Microsystems, Inc. (United States)
Martin Sosa, Hytek Microsystems, Inc. (United States)


Published in SPIE Proceedings Vol. 3708:
Digital Wireless Communication
Raghuveer M. Rao; Soheil A. Dianat; Michael D. Zoltowski, Editor(s)

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