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Proceedings Paper

Thermomechanical distortions of advanced optical reticles during exposure
Author(s): Jaehyuk Chang; Amr Y. Abdo; Byung-Kyu Kim; Theodore M. Bloomstein; Roxann L. Engelstad; Edward G. Lovell; William A. Beckman; John W. Mitchell
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Paper Abstract

If optical lithography is to be extended into the 157 nm regime, controlling mask-related distortions will be a necessity. Thermomechanical distortions during exposure could be a major source of pattern placement error, especially if alternative materials such as CaF2 or MgF2 are employed. Full 3D finite element heat transfer and structural models have been developed to simulate the response of the reticle during both full-field and scanning exposure systems. Transient and periodic steady-state temperature distributions have been determined for typical exposure duty cycles. Corresponding in-plane and out-of- plane thermal distortions have been identified for both fused silica and calcium fluoride substrates. Under equivalent exposure conditions, the distortions in the CaF2 are significantly higher.

Paper Details

Date Published: 25 June 1999
PDF: 12 pages
Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999); doi: 10.1117/12.351144
Show Author Affiliations
Jaehyuk Chang, Univ. of Wisconsin/Madison (United States)
Amr Y. Abdo, Univ. of Wisconsin/Madison (United States)
Byung-Kyu Kim, Univ. of Wisconsin/Madison (United States)
Theodore M. Bloomstein, MIT Lincoln Lab. (United States)
Roxann L. Engelstad, Univ. of Wisconsin/Madison (United States)
Edward G. Lovell, Univ. of Wisconsin/Madison (United States)
William A. Beckman, Univ. of Wisconsin/Madison (United States)
John W. Mitchell, Univ. of Wisconsin/Madison (United States)


Published in SPIE Proceedings Vol. 3676:
Emerging Lithographic Technologies III
Yuli Vladimirsky, Editor(s)

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