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Proceedings Paper

Modal analysis of the SCALPEL mask using experimental and numerical methods
Author(s): William H. Semke; Michael P. Schlax; Roxann L. Engelstad; Edward G. Lovell; James Alexander Liddle
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Paper Abstract

Controlling the dynamic response of the SCALPEL mask is important to ensure high throughput consistent with the stringent error budgets allocated for sub-130 nm lithography. In this paper experimental and numerical modal analysis result for the SCALPEL mask are presented and compared. These experimental result are used to verify and benchmark the finite element modeling efforts. The mode shapes and their respective frequencies provide valuable information for characterizing the out-of-plane and in-plane oscillations of the mask. The out-of-plane mode shapes were found experimentally with the use of both a Zygo interferometer and a Polytec scanning laser vibrometer. An additional application for out-of-plane oscillations involves a SCALPEL mask cleaning procedure, called the PLAMAX process, where the mask is resonated at its natural frequencies while surface particles are electrostatically charged in the present of a plasma and removed. The in-plane vibrations of the SCALPEL mask have also been investigated, since this is the primary excitation mode of the mask during exposure stepping. For experimental data, the in-plane modes were excited mechanically and detected using a MTI Fotonic sensor fiber-optic probe.

Paper Details

Date Published: 25 June 1999
PDF: 12 pages
Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999); doi: 10.1117/12.351129
Show Author Affiliations
William H. Semke, Univ. of Wisconsin/Madison (United States)
Michael P. Schlax, Univ. of Wisconsin/Madison (United States)
Roxann L. Engelstad, Univ. of Wisconsin/Madison (United States)
Edward G. Lovell, Univ. of Wisconsin/Madison (United States)
James Alexander Liddle, Lucent Technologies/Bell Labs. (United States)


Published in SPIE Proceedings Vol. 3676:
Emerging Lithographic Technologies III
Yuli Vladimirsky, Editor(s)

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