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Proceedings Paper

Overlay error budgets for a high-throughput SCALPEL system
Author(s): Stuart T. Stanton; Reginald C. Farrow; Gregg M. Gallatin; James Alexander Liddle; Warren K. Waskiewicz
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Paper Abstract

The implementation of SCALPEL for post-optical production lithography generations, including mix-and-match options, involves unique issues in alignment and overlay. SCALPEL's use of stitching modifies the familiar analysis of overlay errors. Stitching may produce a small, localized image- placement error, but it creates negligible fixed image distortion. It also allows sub-field placement adjustments to correct some of the distortion errors in mix-and-match optimization. SCALPEL can use existing off-axis alignment sensor technologies, but a preferred electron back-scatter technique offers robustness and versatility. For high- throughput operation, a form of global alignment similar to that of full-field tools is likely, but implemented with the dynamic alignment mark scanning capabilities available in the writing strategy. Finally, it is expected that wafer- heating correction issues will factor into the coupled development of optimum writing and alignment strategies, possibly introducing novel mixed operating modes of fine alignment. We shall discus our present overlay error budgets, representing these unique challenges and opportunities for developing a high-throughput SCALPEL tool.

Paper Details

Date Published: 25 June 1999
PDF: 13 pages
Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999); doi: 10.1117/12.351127
Show Author Affiliations
Stuart T. Stanton, Lucent Technologies/Bell Labs. (United States)
Reginald C. Farrow, Lucent Technologies/Bell Labs. (United States)
Gregg M. Gallatin, Lucent Technologies/Bell Labs. (United States)
James Alexander Liddle, Lucent Technologies/Bell Labs. (United States)
Warren K. Waskiewicz, Lucent Technologies/Bell Labs. (United States)


Published in SPIE Proceedings Vol. 3676:
Emerging Lithographic Technologies III
Yuli Vladimirsky, Editor(s)

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