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Proceedings Paper

Writing strategy for a high-throughput SCALPEL system
Author(s): Stuart T. Stanton; James Alexander Liddle; Joseph A. Felker; Warren K. Waskiewicz; Lloyd R. Harriott
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Paper Abstract

Successful deployment of SCALPEL for several post-optical production lithography generations requires a unique optimum writing-strategy. Since the electron optics sub-field and the strutted mask patten segment are both smaller than the final device image area, SCALPEL utilizes a stitching approach to image-formation. A dynamic sub-field placement scheme, or 'writing strategy', must provide precise 2D stitching at high speed, and eliminate mask strut images on the wafer. It should also provide the extended dynamic lens field necessary for good throughput, while minimizing all non-exposure times per wafer and maintaining the time- averaged current near the instantaneous space-charge limit. The preferred writing-strategy replaces mechanical stage acceleration events with beam deflection wherever possible. The unique writing-strategy presented here also generates the required 2D seam-blending dose-profiles, which are vital to robust CD control with stitching.

Paper Details

Date Published: 25 June 1999
PDF: 13 pages
Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999); doi: 10.1117/12.351091
Show Author Affiliations
Stuart T. Stanton, Lucent Technologies/Bell Labs. (United States)
James Alexander Liddle, Lucent Technologies/Bell Labs. (United States)
Joseph A. Felker, Lucent Technologies/Bell Labs. (United States)
Warren K. Waskiewicz, Lucent Technologies/Bell Labs. (United States)
Lloyd R. Harriott, Lucent Technologies/Bell Labs. (United States)


Published in SPIE Proceedings Vol. 3676:
Emerging Lithographic Technologies III
Yuli Vladimirsky, Editor(s)

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