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Proceedings Paper

New polymeric materials for designing photoresistors and photodetective assemblies based on CdHgTe
Author(s): L. M. Khitrova; Y. S. Troshkin; V. P. Belyaev; G. E. Popovyan; L. V. Kiseleva
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Paper Abstract

In order to improve quality of photodetectors and photodetective assemblies two new cryo- and chemically resistant adhesives were developed: epoxy-silico-organic adhesive `(Phi) X-5P' and acrylic `OPHOH-2' adhesive for gluing of CdHgTe wafers to a substrate `XCK-H' vacuum-tight modified adhesive is used for attaching of inlet windows and glass holder elements. `OPUOH-65' vibration damping thixotropic composition was developed for mounting of multi- layer printed circuits.

Paper Details

Date Published: 10 June 1999
PDF: 3 pages
Proc. SPIE 3819, International Conference on Photoelectronics and Night Vision Devices, (10 June 1999); doi: 10.1117/12.350901
Show Author Affiliations
L. M. Khitrova, ORION Research, Development, and Production Ctr. (Russia)
Y. S. Troshkin, ORION Research, Development, and Production Ctr. (Russia)
V. P. Belyaev, ORION Research, Development, and Production Ctr. (Russia)
G. E. Popovyan, ORION Research, Development, and Production Ctr. (Russia)
L. V. Kiseleva, ORION Research, Development, and Production Ctr. (Russia)


Published in SPIE Proceedings Vol. 3819:
International Conference on Photoelectronics and Night Vision Devices
Anatoly M. Filachev, Editor(s)

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