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Proceedings Paper

Defect inspection on CMP process and its application
Author(s): Minori N. Noguchi; Yoshimasa Oshima; Hidetoshi Nishiyama; Kenji Watanabe; Aritoshi Sugimoto
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Paper Abstract

A high-throughput high-sensitivity defect-detection technique has been developed for manufacturing 0.15-0.25- micrometers LSI devices. It incorporates a high-resolution detection systems using multi-channel detectors and a high- resolution imaging system using spatial filtering and collimated focused-beam illumination. A new algorithm called correlated local area statistical threshold enables this technique to achieve a sensitivity of 0.15 micrometers on front- end processes and 0.3 micrometers on back-end processes and a high throughput.

Paper Details

Date Published: 14 June 1999
PDF: 6 pages
Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); doi: 10.1117/12.350865
Show Author Affiliations
Minori N. Noguchi, Hitachi, Ltd. (Japan)
Yoshimasa Oshima, Hitachi, Ltd. (Japan)
Hidetoshi Nishiyama, Hitachi, Ltd. (Japan)
Kenji Watanabe, Hitachi, Ltd. (Japan)
Aritoshi Sugimoto, Hitachi, Ltd. (Japan)


Published in SPIE Proceedings Vol. 3677:
Metrology, Inspection, and Process Control for Microlithography XIII
Bhanwar Singh, Editor(s)

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