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Proceedings Paper

Automatic macroinspection system
Author(s): Koichiro Komatsu; Takeo Omori; Toshiaki Kitamura; Yasuharu Nakajima; Arun A. Aiyer; Kyoichi Suwa
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Paper Abstract

Macroscopic defects on a wafer are caused by contamination, inhomogeneous resist-thickness, scratches etc. Many of these effects can be observed directly by human eyes rather than through a microscope. In many lithographic processes visual inspection by human operator is performed on all wafers after the developing process. It is called a 'macro inspection'. However a macro inspection takes skill of detecting defects, because defects can be found under some conditions. We have been developing a new inspection system to replace operator-inspection with instrument-inspection for consistency in results. This system is constructed by a defect detecting technology and an image processing technology.

Paper Details

Date Published: 14 June 1999
PDF: 8 pages
Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); doi: 10.1117/12.350863
Show Author Affiliations
Koichiro Komatsu, Nikon Corp. (Japan)
Takeo Omori, Nikon Corp. (Japan)
Toshiaki Kitamura, Nikon Corp. (Japan)
Yasuharu Nakajima, Nikon Corp. (Japan)
Arun A. Aiyer, Nikon Research Corp. of America (United States)
Kyoichi Suwa, Nikon Corp. (Japan)


Published in SPIE Proceedings Vol. 3677:
Metrology, Inspection, and Process Control for Microlithography XIII
Bhanwar Singh, Editor(s)

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