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Proceedings Paper

Improved wafer stepper alignment performance using an enhanced phase grating alignment system
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Paper Abstract

Processes such as chemical mechanical polishing and spin coating can result in the asymmetric deformation of alignment marks. In this paper, the effects of such asymmetric mark deformations on the accuracy of the stepper alignment system are investigate. An advanced phase grating alignment system is presented which is more robust against the above mentioned process-induced alignment deviations. The potential of the new alignment system will be illustrated with result of both numerical simulations and experimental measurements. Various process modules that are known to cause mark deformations have been investigated.

Paper Details

Date Published: 14 June 1999
PDF: 13 pages
Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); doi: 10.1117/12.350826
Show Author Affiliations
Jaap H. M. Neijzen, Philips Research Labs. (Netherlands)
Robert D. Morton, Philips Research Labs. (Netherlands)
Peter Dirksen, Philips Research Labs. (Belgium)
Henry J. L. Megens, ASM Lithography B.V. (Netherlands)
Frank Bornebroek, ASM Lithography B.V. (Netherlands)


Published in SPIE Proceedings Vol. 3677:
Metrology, Inspection, and Process Control for Microlithography XIII
Bhanwar Singh, Editor(s)

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