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Proceedings Paper

Characterization of overlay tolerance requirements for via to metal alignment
Author(s): John A. Allgair; Mike Schippers; Brad Smith; Richard C. Elliott; John D. Miller; John Charles Robinson
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Paper Abstract

Decreasing metal interconnect dimensions have led to tighter overlay tolerance requirements to ensure via to metal contact. These strict requirements often test the alignment capability of a manufacturing line; therefore, careful characterization is required to justify the overlay specification limits. A variety of technique can be combined for overlay process characterization including electrical resistance measurements, optical overlay measurements, CD SEM via misalignments and x-section yield. Available characterization techniques are then used to fully study the process window. Characterization data will be presented for a copper interconnect process.

Paper Details

Date Published: 14 June 1999
PDF: 9 pages
Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); doi: 10.1117/12.350811
Show Author Affiliations
John A. Allgair, Motorola (United States)
Mike Schippers, Motorola (United States)
Brad Smith, Motorola (United States)
Richard C. Elliott, KLA Tencor Corp. (United States)
John D. Miller, KLA Tencor Corp. (United States)
John Charles Robinson, KLA Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 3677:
Metrology, Inspection, and Process Control for Microlithography XIII
Bhanwar Singh, Editor(s)

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