Share Email Print
cover

Proceedings Paper

Two-dimensional calibration artifact and measurement methodology
Author(s): Richard M. Silver; Theodore D. Doiron; William B. Penzes; Edward Kornegay; Stephen H. Fox; Michael T. Takac; Stephen C. Rathjen; David T. Owens
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper we describe our design and the manufacturing of a 2D grid artifact of chrome on quartz on a 150 mm X 150 mm X 6.35 mm plate. The design has been agreed upon by a number of Semiconductor Equipment Manufacturers International participants working on a 2D grids calibration task force within the microlithography committee of SEMI. We present the measurement procedures and describe the algorithms used in the measurement process. We have procured a prototype artifact which is expected to be developed into a National Institute of Standards and Technology (NIST) distributed standard reference material once the final design has been agree upon. We will present measurements made at leading industrial sites and develop a traceability chain based on these measurements in combination with NIST based measurements. The artifact has been measured on the NIST linescale interferometer as well as other NIST metrology tools. We will also present the status of the comparisons between these measurements and those performed by the industrial collaborators.

Paper Details

Date Published: 14 June 1999
PDF: 16 pages
Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); doi: 10.1117/12.350799
Show Author Affiliations
Richard M. Silver, National Institute of Standards and Technology (United States)
Theodore D. Doiron, National Institute of Standards and Technology (United States)
William B. Penzes, National Institute of Standards and Technology (United States)
Edward Kornegay, National Institute of Standards and Technology (United States)
Stephen H. Fox, National Institute of Standards and Technology (United States)
Michael T. Takac, IBM Corp. (United States)
Stephen C. Rathjen, Photronics, Inc. (United States)
David T. Owens, Photronics, Inc. (United States)


Published in SPIE Proceedings Vol. 3677:
Metrology, Inspection, and Process Control for Microlithography XIII
Bhanwar Singh, Editor(s)

© SPIE. Terms of Use
Back to Top