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Proceedings Paper

Piezoelectrical wire feeding system for micropositioning in bonding machines
Author(s): Andreas Henke; Martin A. Kuemmel; Joerg Wallaschek
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Paper Abstract

In this report a new wire feeding system for fine wire bonding machines and its development is presented. The system is driven by a piezoelectric actuator, which replaces the electromagnetic actuators used in present bonding machines. To minimize the time used to develop the piezoelectric system, several models of the system have been derived and simulations have been made, to optimize the systems performance. After the wire feeding system has been manufactured, experiments have been made to validate the results conceived from the simulations. The performance improvement to the currently used feeding system is discussed.

Paper Details

Date Published: 9 June 1999
PDF: 9 pages
Proc. SPIE 3668, Smart Structures and Materials 1999: Smart Structures and Integrated Systems, (9 June 1999); doi: 10.1117/12.350740
Show Author Affiliations
Andreas Henke, Univ.-Gesamthochschule Paderborn (Germany)
Martin A. Kuemmel, Univ.-Gesamthochschule Paderborn (Germany)
Joerg Wallaschek, Univ.-Gesamthochschule Paderborn (Germany)


Published in SPIE Proceedings Vol. 3668:
Smart Structures and Materials 1999: Smart Structures and Integrated Systems
Norman M. Wereley, Editor(s)

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