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Proceedings Paper

Planarizing AR for DUV lithography
Author(s): Timothy G. Adams; Suzanne Coley; Manuel doCanto; Dana Gronbeck; Matthew King; Edward K. Pavelchek
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Paper Abstract

A systematic approach was taken in order to improve the planarity of a DUV anti reflectant (AR) utilized for various lithographic steps, particularly those involving a patterned transparent layer. These layers can occur in both front and back end processing. Two approaches were pursued to accomplish this. The first approach was to minimize the molecular weight of the AR polymer. Polymers with weight average molecular weights from 45,000 daltons to as low as 2,300 daltons were evaluated. The planarity of the AR improved significantly for polymers with Mw's below 20,000 daltons. The second approach was to add plasticizers in order to reduce the glass transition temperature of the precrosslinked film. The addition of plasticizers to the AR was effective in increasing the planarity. One of the plasticizers contained a DUV chromophore used to maintain the required optical density of the AR. It was proven possible to make these changes while maintaining lithographic performance in both resist profiles and reflection control.

Paper Details

Date Published: 11 June 1999
PDF: 8 pages
Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); doi: 10.1117/12.350273
Show Author Affiliations
Timothy G. Adams, Shipley Co. Inc. (United States)
Suzanne Coley, Shipley Co. Inc. (United States)
Manuel doCanto, Shipley Co. Inc. (United States)
Dana Gronbeck, Shipley Co. Inc. (United States)
Matthew King, Shipley Co. Inc. (United States)
Edward K. Pavelchek, Shipley Co. Inc. (United States)


Published in SPIE Proceedings Vol. 3678:
Advances in Resist Technology and Processing XVI
Will Conley, Editor(s)

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