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Proceedings Paper

Process characterization of 100-μm-thick photoresist films
Author(s): Warren W. Flack; Sylvia White; Bradley Todd
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Paper Abstract

The number of lithographic applications that require the use of photoresist thickness of one hundred microns or more is rapidly increasing. Extremely large structure heights and high aspect ratios are often required for micro- electrodeposition of mechanical components such as coils, cantilevers and valves. These ultra-thick photoresist can also be used as a mold in micro-electromechanical systems. Ultra-thick photoresist are also used in bump bond applications to define the size and location of the bonds for advanced flipchip packaging.

Paper Details

Date Published: 11 June 1999
PDF: 17 pages
Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); doi: 10.1117/12.350230
Show Author Affiliations
Warren W. Flack, Ultratech Stepper, Inc. (United States)
Sylvia White, Ultratech Stepper, Inc. (United States)
Bradley Todd, Ultratech Stepper, Inc. (United States)

Published in SPIE Proceedings Vol. 3678:
Advances in Resist Technology and Processing XVI
Will Conley, Editor(s)

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