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Proceedings Paper

Characterization and lithographic parameter extraction for the modified resists
Author(s): Fu-Hsiang Ko; June-Kuen Lu; Tien-Chi Chu; Tiao-Yuan Huang; ChinCheng Yang; Jinn-Tsair Sheu; Hui-Ling Huang
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Paper Abstract

The modification of the i-line resist structure after spiking with various amount of poly(4-vinylphenol) polymer is characterized by the spectra of UV visible and gel permeation chromatography. The chemical structure of photoactive compound is found to be unchanged after modification, while slight change in the polymer chain is observed. The resist layer coated onto the wafer is characterized by various methods including n and k analyzer, Nanospec, Fourier transform IR red, thermogravimetric analysis, and differential scanning calorimetry to fully evaluate the film properties in terms of porosity, thickness, vibrational spectrum, and thermal stability. Our thermal analysis results show that the resists are mainly decomposed in three stages. The photoactive compound is found to decompose during the first stage, while the polymer decomposes during the latter stages. The resist exposure parameters, namely, A, B and C at 365 nm are determined by the absorbance measurement. The extracted parameters are further used in the resist profile simulation by PROLITH/2. It is shown that the spiking of poly(4-vinylphenol) polymer into the resist can improve the resolution and linearity for dense lines. In addition, the swing effects can be reduced by up to 35 and 31 percent for dense and isolated lines after resist modification, respectively.

Paper Details

Date Published: 11 June 1999
PDF: 11 pages
Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); doi: 10.1117/12.350225
Show Author Affiliations
Fu-Hsiang Ko, National Chiao Tung Univ. (Taiwan)
June-Kuen Lu, National Tsing Hua Univ. (Taiwan)
Tien-Chi Chu, National Tsing Hua Univ. (Taiwan)
Tiao-Yuan Huang, National Chiao Tung Univ. (Taiwan)
ChinCheng Yang, National Chiao Tung Univ. (Taiwan)
Jinn-Tsair Sheu, National Chiao Tung Univ. (Taiwan)
Hui-Ling Huang, Industrial Technology Research Institute (Taiwan)


Published in SPIE Proceedings Vol. 3678:
Advances in Resist Technology and Processing XVI
Will Conley, Editor(s)

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