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Proceedings Paper

Comparative study of resist stabilization techniques for metal etch processing
Author(s): Gerry Becker; Matthew F. Ross; Selmer S. Wong; Jason P. Minter; Trey Marlowe; William R. Livesay
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Paper Abstract

This study investigates resist stabilization techniques as they are applied to a metal etch application. The techniques that are compared are conventional deep-UV/thermal stabilization, or UV bake, and electron beam stabilization. The electron beam tool use din this study, an ElectronCure system from AlliedSignal Inc., ELectron Vision Group, utilizes a flood electron source and a non-thermal process. These stabilization techniques are compared with respect to a metal etch process. In this study, two types of resist are considered for stabilization and etch: a g/i-line resist, Shipley SPR-3012, and an advanced i-line, Shipley SPR 955- Cm. For each of these resist the effects of stabilization on resist features are evaluated by post-stabilization SEM analysis. Etch selectivity in all cases is evaluated by using a timed metal etch, and measuring resists remaining relative to total metal thickness etched. Etch selectivity is presented as a function of stabilization condition. Analyses of the effects of the type of stabilization on this method of selectivity measurement are also presented. SEM analysis was also performed on the features after a compete etch process, and is detailed as a function of stabilization condition. Post-etch cleaning is also an important factor impacted by pre-etch resist stabilization. Results of post- etch cleaning are presented for both stabilization methods. SEM inspection is also detailed for the metal features after resist removal processing.

Paper Details

Date Published: 11 June 1999
PDF: 10 pages
Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); doi: 10.1117/12.350164
Show Author Affiliations
Gerry Becker, AlliedSignal Inc. (United States)
Matthew F. Ross, AlliedSignal Inc. (United States)
Selmer S. Wong, AlliedSignal Inc. (United States)
Jason P. Minter, AlliedSignal Inc. (United States)
Trey Marlowe, AlliedSignal Inc. (United States)
William R. Livesay, AlliedSignal Inc. (United States)


Published in SPIE Proceedings Vol. 3678:
Advances in Resist Technology and Processing XVI
Will Conley, Editor(s)

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