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Proceedings Paper

Low-temperature technique for thick film resist stabilization and curing
Author(s): Jason P. Minter; Selmer S. Wong; Trey Marlowe; Matthew F. Ross; Mark E. Narcy; William R. Livesay
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Paper Abstract

For a range of thick film photoresist applications, including MeV ion implant processing, thin film head manufacturing, and microelectromechanical systems processing, there is a need for a low-temperature method for resist stabilization and curing. Traditional methods of stabilizing or curing resist films have relied on thermal cycling, which may not be desirable due to device temperature limitations or thermally-induced distortion of the resist features.

Paper Details

Date Published: 11 June 1999
PDF: 12 pages
Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); doi: 10.1117/12.350163
Show Author Affiliations
Jason P. Minter, AlliedSignal Inc. (United States)
Selmer S. Wong, AlliedSignal Inc. (United States)
Trey Marlowe, AlliedSignal Inc. (United States)
Matthew F. Ross, AlliedSignal Inc. (United States)
Mark E. Narcy, AlliedSignal Inc. (United States)
William R. Livesay, AlliedSignal Inc. (United States)


Published in SPIE Proceedings Vol. 3678:
Advances in Resist Technology and Processing XVI
Will Conley, Editor(s)

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