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Proceedings Paper

Flexible packaging and interconnect scheme for microfluidic systems
Author(s): William J. Benett; Peter A. Krulevitch
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Paper Abstract

A slide-together compression package and microfluidic interconnects for microfabricated devices requiring fluidic and electrical connections is presented. The package assembles without tools, is reusable, and requires no epoxy, wirebonds, or solder, making chip replacement fast and easy. The microfluidic interconnects use standard HPLC PEEK tubing, with the tip machined to accept either an o-ring or custom molded ring which serves the dual function of forming the seal and providing mechanical retention strength. One design uses a screw to compress the o-ring, while others are simply plugged into a cartridge retained in the package. The connectors are helium leak-tight, can withstand hundreds of psi, are easy to connect and disconnect, are low dead volume, have a small footprint, and are adaptable to a broad range of microfabricated devices.

Paper Details

Date Published: 3 June 1999
PDF: 8 pages
Proc. SPIE 3606, Micro- and Nanofabricated Structures and Devices for Biomedical Environmental Applications II, (3 June 1999); doi: 10.1117/12.350051
Show Author Affiliations
William J. Benett, Lawrence Livermore National Lab. (United States)
Peter A. Krulevitch, Lawrence Livermore National Lab. (United States)


Published in SPIE Proceedings Vol. 3606:
Micro- and Nanofabricated Structures and Devices for Biomedical Environmental Applications II
Mauro Ferrari, Editor(s)

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