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Proceedings Paper

Electrical crosstalk analysis in OEIC modules
Author(s): Dimitrios Varoutas; A. Arapogianni; Dimitrios Syvridis; Thomas Sphicopoulos
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Paper Abstract

A complete set of methods for the calculation of electrical crosstalk in Optoelectronic Integrated Circuits is presented. From the examination of typical chip architecture, it is shown that the inductive coupling due to thin bondwires is critical. The model can be easily applied to several OEICs. Design guidelines are presented.

Paper Details

Date Published: 30 April 1999
PDF: 11 pages
Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); doi: 10.1117/12.348323
Show Author Affiliations
Dimitrios Varoutas, Univ. of Athens (Greece)
A. Arapogianni, Univ. of Athens (Greece)
Dimitrios Syvridis, Univ. of Athens (Greece)
Thomas Sphicopoulos, Univ. of Athens (Greece)


Published in SPIE Proceedings Vol. 3631:
Optoelectronic Integrated Circuits and Packaging III
Michael R. Feldman; Michael R. Feldman; James G. Grote; Mary K. Hibbs-Brenner, Editor(s)

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