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Proceedings Paper

Wafer scale integration of micro-optic and optoelectronic elements by polymer UV reaction molding
Author(s): Peter Dannberg; Ralf Bierbaum; Lars Erdmann; Andreas H. Braeuer
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Paper Abstract

A replication technique allowing for the wafer scale integration of microoptical elements is presented and illustrated by various examples. The technique is based on polymer UV reaction moulding using a modified contact mask aligned where mask and wafer are replaced by the replication tool and an arbitrary substrate, respectively. The technology takes advantage of the high precision and adjustment accuracy of photolithography equipment. The replication masters are nickel shims, etched Silicon wafers or uv-transparent fused silica tools. The latter ones allow for replication on opaque substrates. Additionally, polymer elements with unique properties can be obtained by the combination of replication and resist technology using partially transparent replication tools. Wafer scale hybrid integration of microoptical subsystems is accomplished by replication of polymer elements like lenses, lens arrays, micro prisms etc. onto semiconductor wafers containing detectors or VCSELs, or by combining microoptical elements on both sides of a glass wafer. The use of thin layers of uv cured polymers on inorganic substrates results in good thermal and mechanical stability compare to all-polymer devices.

Paper Details

Date Published: 30 April 1999
PDF: 8 pages
Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); doi: 10.1117/12.348319
Show Author Affiliations
Peter Dannberg, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Ralf Bierbaum, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Lars Erdmann, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Andreas H. Braeuer, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)


Published in SPIE Proceedings Vol. 3631:
Optoelectronic Integrated Circuits and Packaging III
Michael R. Feldman; Michael R. Feldman; James G. Grote; Mary K. Hibbs-Brenner, Editor(s)

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