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Proceedings Paper

Manufacturing cost analysis of integrated photonic packages
Author(s): Charles W. Stirk; Qin Liu; Matthew V. Ball
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Paper Abstract

This paper analyzes the manufacturing cost of photonic system using software that combines several methods for accurate cost accounting. Activity based costing assigns al capital equipment, material and labor costs directly to the product rather than to overheads. Cost of ownership models determine the cost of using machines under different financial and utilization scenarios. Libraries of standard machines, process steps, and process sequences facilitate rapid model building and modification. Using libraries for semiconductor and photonics fabrication, along with packaging and optomechanical assembly, we construct cost models for 2D VCSEL array communication modules. The result of the analysis is that the model cost is driven mainly by the epitaxial material cost, and laser yield limits VCSEL arrays to small scale integration.

Paper Details

Date Published: 30 April 1999
PDF: 10 pages
Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); doi: 10.1117/12.348317
Show Author Affiliations
Charles W. Stirk, Bosonics Inc. (United States)
Qin Liu, Bosonics Inc. (United States)
Matthew V. Ball, Bosonics Inc. (United States)

Published in SPIE Proceedings Vol. 3631:
Optoelectronic Integrated Circuits and Packaging III
Michael R. Feldman; Michael R. Feldman; James G. Grote; Mary K. Hibbs-Brenner, Editor(s)

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