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Micro integration of VCSELs, detectors, and optics
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Paper Abstract

System alignment is often the cost driver in the production of optical system. In order to both miniaturize and reduce production costs, wafer scale integration of active and passive components is required. This integration relies on a host of techniques to align and bond active and passive devices into a monolithic structure. Moreover, this initial packaging is accomplished while the optics and supporting structures are in wafer form, thereby providing parallel fabrication with resultant cost savings. This paper describes the fundamental techniques for producing IMOS from wafer scale substrates. The relative merits of each approach are discussed, along with design concerns for successful application. Two example systems are discussed, each using a different fabrication technique.

Paper Details

Date Published: 30 April 1999
PDF: 8 pages
Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); doi: 10.1117/12.348316
Show Author Affiliations
John Barnett Hammond, Digital Optics Corp. (United States)
Eric G. Johnson, Digital Optics Corp. (United States)
Hongtao Han, Digital Optics Corp. (United States)
Adam S. Fedor, Digital Optics Corp. (United States)

Published in SPIE Proceedings Vol. 3631:
Optoelectronic Integrated Circuits and Packaging III
Michael R. Feldman; Michael R. Feldman; James G. Grote; Mary K. Hibbs-Brenner, Editor(s)

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