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Proceedings Paper

Design of CMOS ICs for flip-chip integration with optoelectronic device arrays
Author(s): Premanand Chandramani; Fouad E. Kiamilev; Ashok V. Krishnamoorthy; Richard G. Rozier; Jeremy T. Ekman; Ray Farbarik
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Paper Abstract

Hybrid integration of optoelectronic devices, such as GaAs MQW modulators, to CMOS VLSI circuits provides the opportunity to design ICs that integrate millions of transistors and thousands of high-speed optical I/Os for high-performance computing and switching applications. One of the challenges in designing such large-scale ICs lies in the development of an efficient method for integrating existing VLSI circuit layouts with 2D arrays of optoelectronic devices. This paper presents several such methods and describes their application.

Paper Details

Date Published: 30 April 1999
PDF: 7 pages
Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); doi: 10.1117/12.348314
Show Author Affiliations
Premanand Chandramani, Univ. of North Carolina/Charlotte (United States)
Fouad E. Kiamilev, Univ. of North Carolina/Charlotte (United States)
Ashok V. Krishnamoorthy, Lucent Technologies/Bell Labs. (United States)
Richard G. Rozier, Univ. of North Carolina/Charlotte (United States)
Jeremy T. Ekman, Univ. of North Carolina/Charlotte (United States)
Ray Farbarik, Tera Computer Co. (United States)


Published in SPIE Proceedings Vol. 3631:
Optoelectronic Integrated Circuits and Packaging III
Michael R. Feldman; James G. Grote; Mary K. Hibbs-Brenner; Michael R. Feldman, Editor(s)

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