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Proceedings Paper

Optical interconnects for high-speed data links
Author(s): Chang Myung Ryu; Bernhard Ulrich Koelle; Shane R. Johnson; Philip Dowd; Raenaurd Datrion Turpin; Parag Kelkar; YongHang Zhang
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Paper Abstract

We demonstrate the integration of vertical-cavity surface- emitting laser (VCSEL) arrays with Si-dummy chips for potential use in short-distance parallel optical interconnects. An 8 X 8 flip-chip bonded InGaAs VCSEL array was successfully modulated at data rates up to 0.8 Gbit/s/channel, corresponding to an aggregate data transmission capacity in excess of 50 Gbit/s. A 2 X 4 VCSEL array was indirectly flit-chip bonded to a Si substrate via a transparent glass carrier and package- limited data rates of 0.4 Gbit/s/channel were achieved. The large signal modulation bandwidth of these devices exceeded 2 Gbit/s. The electrical driving characteristics of the devices were found to be compatible with 3.3 V CMOS technology.

Paper Details

Date Published: 30 April 1999
PDF: 8 pages
Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); doi: 10.1117/12.348313
Show Author Affiliations
Chang Myung Ryu, Arizona State Univ. (United States)
Bernhard Ulrich Koelle, Arizona State Univ. (United States)
Shane R. Johnson, Arizona State Univ. (United States)
Philip Dowd, Arizona State Univ. (United States)
Raenaurd Datrion Turpin, Arizona State Univ. (United States)
Parag Kelkar, Arizona State Univ. (United States)
YongHang Zhang, Arizona State Univ. (United States)


Published in SPIE Proceedings Vol. 3631:
Optoelectronic Integrated Circuits and Packaging III
Michael R. Feldman; Michael R. Feldman; James G. Grote; Mary K. Hibbs-Brenner, Editor(s)

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