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Proceedings Paper

Packaging of lenslet array on micromirrors
Author(s): Adisorn Tuantranont; Victor M. Bright; Wenge Zhang; Yung-Cheng Lee
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Paper Abstract

A packaging technology has been developed to integrate a lenslet array with surface micromachined segmented deformable micromirrors. 12 X 12 electrostatic micromirror arrays were fabricated through a commercial surface micromachining process and integrated with glass microlenses positioned directly over the micromirror. Control of the spacing and the lateral alignment between the lenslet array and the micromirrors was important for effective fill factor. The spacing control was accomplished using glass spacer, and the lateral alignments were achieved by the use of an interferometric microscope. Measured results of the micromirrors' optical performance demonstrated the success of the packaging technology.

Paper Details

Date Published: 30 April 1999
PDF: 9 pages
Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); doi: 10.1117/12.348308
Show Author Affiliations
Adisorn Tuantranont, Univ. of Colorado/Boulder (United States)
Victor M. Bright, Univ. of Colorado/Boulder (United States)
Wenge Zhang, Univ. of Colorado/Boulder (United States)
Yung-Cheng Lee, Univ. of Colorado/Boulder (United States)


Published in SPIE Proceedings Vol. 3631:
Optoelectronic Integrated Circuits and Packaging III
Michael R. Feldman; Michael R. Feldman; James G. Grote; Mary K. Hibbs-Brenner, Editor(s)

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