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Proceedings Paper

Active-to-passive element microassembly for photonic microsystems
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Paper Abstract

New methods for integration of dissimilar components and optical inputs/outputs are expected to mass-produce photonic micro-systems at reduced levels of difficulty and therefore reduced cost. These methods involve monolithic and hybrid approaches, the latter at both wafer-to-wafer and chip-to- wafer levels. Broadly, these are called 'heterogeneous integration' and encompass technologies as diverse as wafer- fusion and DNA-assisted micro-assembly. This review summarizes the associated micro-assembly techniques and discusses their possible influence upon cost- and yield-benefits to industry.

Paper Details

Date Published: 28 April 1999
PDF: 9 pages
Proc. SPIE 3666, International Conference on Fiber Optics and Photonics: Selected Papers from Photonics India '98, (28 April 1999); doi: 10.1117/12.347927
Show Author Affiliations
Sayan D. Mukherjee, Norwegian Univ. of Science and Technology (Sweden)
Thor Bakke, Norwegian Univ. of Science and Technology (Germany)


Published in SPIE Proceedings Vol. 3666:
International Conference on Fiber Optics and Photonics: Selected Papers from Photonics India '98
Anurag Sharma; Banshi Dhar Gupta; Ajoy K. Ghatak, Editor(s)

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