Share Email Print
cover

Proceedings Paper

Fault location in printed wiring boards using thermal imaging
Author(s): Fremont Reizman
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

A case history is presented in which infrared imaging is used to locate shorts in a complex printed wiring board. Passing current through the short heats the conductor trace, and the current path is delineated on the IR image. This method is shown to be useful for a variety of current-carrying structures, both for failure analysis and reverse engineering. It can often be used with very limited knowledge of the detailed function of the device.

Paper Details

Date Published: 1 March 1990
PDF: 6 pages
Proc. SPIE 1313, Thermosense XII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications, (1 March 1990); doi: 10.1117/12.34728
Show Author Affiliations
Fremont Reizman, Hughes Aircraft Company (United States)


Published in SPIE Proceedings Vol. 1313:
Thermosense XII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications
Sharon A. Semanovich, Editor(s)

© SPIE. Terms of Use
Back to Top