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Proceedings Paper

Fabrication of CMOS image sensors
Author(s): Yacov Malinovich; Ephie Koltin; David Choen; Moshe Shkuri; Meir Ben-Simon
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Paper Abstract

In order to provide its customers with sub-micron CMOS fabrication solutions for imaging applications, Tower Semiconductor initiated a project to characterize the optical parameters of Tower's 0.5-micron process. A special characterization test chip was processed using the TS50 process. The results confirmed a high quality process for optical applications. Perhaps the most important result is the process' very low dark current, of 30-50 pA/cm2, using the entire window of process. This very low dark current characteristic was confirmed for a variety of pixel architectures. Additionally, we have succeeded to reduce and virtually eliminate the white spots on large sensor arrays. As a foundry Tower needs to support fabrication of many different imaging products. Therefore we have developed a fabrication methodology that is adjusted to the special needs of optical applications. In order to establish in-line process monitoring of the optical parameters, Tower places a scribe line optical test chip that enables wafer level measurements of the most important parameters, ensuring the optical quality and repeatability of the process. We have developed complementary capabilities like in house deposition of color filter and fabrication of very large are dice using sub-micron CMOS technologies. Shellcase and Tower are currently developing a new CMOS image sensor optical package.

Paper Details

Date Published: 27 April 1999
PDF: 11 pages
Proc. SPIE 3649, Sensors, Cameras, and Systems for Scientific/Industrial Applications, (27 April 1999); doi: 10.1117/12.347076
Show Author Affiliations
Yacov Malinovich, Tower Semiconductor Ltd. (Israel)
Ephie Koltin, Tower Semiconductor Ltd. (Israel)
David Choen, Tower Semiconductor Ltd. (Israel)
Moshe Shkuri, Tower Semiconductor Ltd. (Israel)
Meir Ben-Simon, Tower Semiconductor Ltd. (Israel)


Published in SPIE Proceedings Vol. 3649:
Sensors, Cameras, and Systems for Scientific/Industrial Applications
Morley M. Blouke; George M. Williams, Editor(s)

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