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Proceedings Paper

Impact of built-in film thickness measurement in CMP process
Author(s): Hiroyuki Yano; Katsuya Okumura; Noriyuki Kondo; Masahiro Horie
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Paper Abstract

CMP is now the planarization method of choice in semiconductor manufacturing. However, CMP is still an immature process. Problems still exist with the uniformity and the stability of the CMP rate. These process variations stem from an incomplete understanding of the mechanism of CMP and the variation of CMP consumable s like slurry, pad and backing film. To compensate for these variations, send- ahead processing and too many measurements are usually required. Obviously, these affect CMP productivity. For better CMP productivity and accurate film thickness control, in-process monitoring is a promising solution. In this paper, a CMP tool with built-in thickness measurement is presented. Such a built-in CMP film thickness monitor must satisfy several requirements: 1) the measurements need to be made at specified chips in the wafer and at specified sites in the chip, 2) the measurements should be accurate, 3) multiple film stack measurements must be possible and 4) high-speed measurements must be possible. These four issues of the built-in film thickness monitor are discussed.

Paper Details

Date Published: 27 April 1999
PDF: 8 pages
Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); doi: 10.1117/12.346938
Show Author Affiliations
Hiroyuki Yano, Toshiba Corp. (Japan)
Katsuya Okumura, Toshiba Corp. (Japan)
Noriyuki Kondo, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Masahiro Horie, Dainippon Screen Manufacturing Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 3743:
In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing

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