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Proceedings Paper

Electron beam column for in-line applications featuring enhanced imaging of high-aspect-ratio structures by selective detection of on-axis secondary electrons
Author(s): Harry Munack; Walter Koegler; Holger Baumgarten; Christian Ruebekohl; Pavel Adamec; Ralf Degenhardt; Hans Peter Feuerbaum; Dieter Winkler
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Paper Abstract

The scanning electron microscope presented here allows for enhanced and selective detection of on-axis secondary electrons by a novel two-detector arrangement in combination with a beam separator. It is based on our high-resolution electron beam column. The off-axis secondary electrons are recorded by a conventional in-lens detector. The on-axis secondary electrons from the primary electrons and deflects them towards a scintillator-based detector. The detector for on-axis secondary electrons can either work in a stand-alone mode or in combination with the in-lens detector. Due to the symmetry of its deflection field, the beam separator causes no first-order chromatic aberrations to the primary beam and the spatial resolution is not deteriorated. A first experimental evaluation has demonstrated the enhanced capabilities of this system.

Paper Details

Date Published: 27 April 1999
PDF: 6 pages
Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); doi: 10.1117/12.346937
Show Author Affiliations
Harry Munack, Applied Materials/Integrated Circuit Testing GmbH (Germany)
Walter Koegler, Applied Materials/Integrated Circuit Testing GmbH (Germany)
Holger Baumgarten, Applied Materials/Integrated Circuit Testing GmbH (Germany)
Christian Ruebekohl, Applied Materials/Integrated Circuit Testing GmbH (Germany)
Pavel Adamec, Applied Materials/Integrated Circuit Testing GmbH (Germany)
Ralf Degenhardt, Applied Materials/Integrated Circuit Testing GmbH (Germany)
Hans Peter Feuerbaum, Applied Materials/Integrated Circuit Testing GmbH (Germany)
Dieter Winkler, Applied Materials/Integrated Circuit Testing GmbH (Germany)


Published in SPIE Proceedings Vol. 3743:
In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing
Kostas Amberiadis; Gudrun Kissinger; Katsuya Okumura; Seshu Pabbisetty; Larg H. Weiland, Editor(s)

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