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Proceedings Paper

Method for yield prediction using a SEM-ADC
Author(s): Fumio Mizuno; Seiji Isogai
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Paper Abstract

Yield prediction using scanning electron microscope- automatic defect classification has the advantage of accuracy as compared with that using optical ADC because SEMs have higher resolving power and give us more information of particle/pattern-defect shape and surface texture than optical microscopes. We have proposed a method to predict die and wafer yield using SEM-ADC, it features (1) defect sampling which is performed in terms of die groups, (2) defect classification which enable us to get killer rates of defects, and (3) yield prediction taking account of the effects of prior level defects.

Paper Details

Date Published: 27 April 1999
PDF: 11 pages
Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); doi: 10.1117/12.346933
Show Author Affiliations
Fumio Mizuno, Hitachi, Ltd. (Japan)
Seiji Isogai, Hitachi, Ltd. (Japan)


Published in SPIE Proceedings Vol. 3743:
In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing
Kostas Amberiadis; Gudrun Kissinger; Katsuya Okumura; Seshu Pabbisetty; Larg H. Weiland, Editor(s)

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