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Proceedings Paper

Application and cost analysis of scatterometry for integrated metrology
Author(s): N. Benesch; Claus Schneider; Lothar Pfitzner; Heiner Ryssel
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Paper Abstract

In semiconductor manufacturing there is a great demand for innovations towards higher cost-effectiveness. The increasing use of integrated metrology is one means to improve manufacturing processes effectively and, hence, to lower costs. Especially for the 300 mm technology, a substantial reduction of costly monitor wafers is required. Moreover, misprocessing has to be reduced by efficient feedback process control. Scatterometry can be a versatile technique for these tasks. In order to define the requirements on integrated scatterometric metrology, a cost and break-even analysis is carried out first. Several conclusions are drawn from the economic analysis to determine appropriate arrangements for scatterometric intensity measurements. The evaluation of intensity signatures measured at a fixed angle of incidence is demonstrated to be a valuable tool for the in-line characterization of critical dimensions and layer thickness.

Paper Details

Date Published: 27 April 1999
PDF: 8 pages
Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); doi: 10.1117/12.346929
Show Author Affiliations
N. Benesch, Fraunhofer Institute of Integrated Circuits (Germany)
Claus Schneider, Fraunhofer Institute of Integrated Circuits (Germany)
Lothar Pfitzner, Fraunhofer Institute of Integrated Circuits (Germany)
Heiner Ryssel, Fraunhofer Institute of Integrated Circuits and Univ. of Erlangen-Nuremberg (Germany)


Published in SPIE Proceedings Vol. 3743:
In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing
Kostas Amberiadis; Gudrun Kissinger; Katsuya Okumura; Seshu Pabbisetty; Larg H. Weiland, Editor(s)

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