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Proceedings Paper

Kill ratio calculation for in-line yield prediction
Author(s): Alfonso Lorenzo; David Oter; Sergio Cruceta; Juan Francisco Valtuena; Gerardo Gonzalez; Carlos Mata
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Paper Abstract

The search for better yields in IC manufacturing calls for a smarter use of the vast amount of data that can be generated by a world class production line.In this scenario, in-line inspection processes produce thousands of wafer maps, number of defects, defect type and pictures every day. A step forward is to correlate these with the other big data- generator area: test. In this paper, we present how these data can be put together and correlated to obtain a very useful yield predicting tool. This correlation will first allow us to calculate the kill ratio, i.e. the probability for a defect of a certain size in a certain layer to kill the die. Then we will use that number to estimate the cosmetic yield that a wafer will have.

Paper Details

Date Published: 27 April 1999
PDF: 9 pages
Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); doi: 10.1117/12.346923
Show Author Affiliations
Alfonso Lorenzo, Lucent Technologies Microelectronica (Spain)
David Oter, Lucent Technologies Microelectronica (Spain)
Sergio Cruceta, Lucent Technologies Microelectronica (Spain)
Juan Francisco Valtuena, Lucent Technologies Microelectronica (Spain)
Gerardo Gonzalez, Lucent Technologies Microelectronica (Spain)
Carlos Mata, Lucent Technologies Microelectronica (Spain)


Published in SPIE Proceedings Vol. 3743:
In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing
Kostas Amberiadis; Gudrun Kissinger; Katsuya Okumura; Seshu Pabbisetty; Larg H. Weiland, Editor(s)

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