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Proceedings Paper

Raw wafer material control to eliminate low yield
Author(s): Cheng-Fu Hsu; W. C. Chang; Wei-Kun Yeh; Steve Lin
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Paper Abstract

In the modern VLSI manufacture, the quality of the silicon raw wafer can not be over-emphasized in multilevel integration circuit manufacture. The silicon raw wafers induced low yield issue including particles, contamination residue and IDDQ failure are found in production lots. All these low yield issues are caused by the worse raw wafer vendor hard laser mark. The raw wafer vendor hard laser mark done by the raw wafer supplier on the wafer shows the ingot batch, the substrate type and the supplier company. When the silicon raw wafers are processed in production from wafer start, the worse vendor laser mark will induced some contamination from different process stage and be resulted in low yield issue. After improving the vendor laser mark process in laser mark procedure as well as method, all the low yield issues were recovered.

Paper Details

Date Published: 23 April 1999
PDF: 8 pages
Proc. SPIE 3742, Process and Equipment Control in Microelectronic Manufacturing, (23 April 1999); doi: 10.1117/12.346249
Show Author Affiliations
Cheng-Fu Hsu, Taiwan Semiconductor Manufacturing Co. (Taiwan)
W. C. Chang, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Wei-Kun Yeh, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Steve Lin, Taiwan Semiconductor Manufacturing Co. (Taiwan)

Published in SPIE Proceedings Vol. 3742:
Process and Equipment Control in Microelectronic Manufacturing
Kevin Yallup; Murali K. Narasimhan, Editor(s)

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