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Proceedings Paper

Embedded optical sensors and data processing for thin film deposition
Author(s): David J. Robbins; Alan Marrs; Christopher Pickering; Allister W. Dann; John L. Glasper; John Russell
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Paper Abstract

Two sensor techniques and a data analysis algorithm have been investigated, to assess their suitability for in-situ process monitoring and integrated metrology in semiconductor manufacture. The first sensor is a prototype system which uses two laser beams of different wavelength to module the surface temperature of a wafer. The ratio of detected thermal radiances at the two wavelengths is ideally independent of wafer emissivity. Initial measurements on differently-processed silicon wafers in the temperature range 620 - 1000 degree(s)C show systematic errors of the order 10 degree(s)C. The second sensor is a spectroscopic ellipsometry system fully integrated onto a low pressure chemical vapor deposition reactor for monitoring and controlling growth of silicon-germanium (SiGe) alloys. Algorithms for determining alloy composition and film thicknesses during growth are discussed. The use of a sample-based particle filter based on Bayesian statistics for tracking a semiconductor process is described for the first time.

Paper Details

Date Published: 23 April 1999
PDF: 7 pages
Proc. SPIE 3742, Process and Equipment Control in Microelectronic Manufacturing, (23 April 1999); doi: 10.1117/12.346246
Show Author Affiliations
David J. Robbins, Defense Evaluation and Research Agency Malvern (United Kingdom)
Alan Marrs, Defense Evaluation and Research Agency Malvern (United Kingdom)
Christopher Pickering, Defense Evaluation and Research Agency Malvern (United Kingdom)
Allister W. Dann, Defense Evaluation and Research Agency Malvern (United Kingdom)
John L. Glasper, Defense Evaluation and Research Agency Malvern (United Kingdom)
John Russell, Defense Evaluation and Research Agency Malvern (United Kingdom)


Published in SPIE Proceedings Vol. 3742:
Process and Equipment Control in Microelectronic Manufacturing
Kevin Yallup; Murali K. Narasimhan, Editor(s)

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