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Proceedings Paper

Characterization of metal profile notching as a result of electron shading in a high-density plasma etcher
Author(s): Fred Smits
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Paper Abstract

In today's high volume manufacturing of semiconductor devices large amounts of capital are required to establish and operate production facilities. Therefore, IC manufacturers are now `cloning' processes to enable products and technologies to be transferred to other sites to provide optimum production flexibility. Unfortunately, these processes cannot always simply be lifted and `dropped' into a new facility, even if identical tools are used. During a process and product transfer from one Motorola fab to another the metal etch process exhibited some unexpected complications as severely undercut metal profiles were seen on certain products. Although initially not very well understood the reason for this defect turned out to be ion deflection due to electron shading. This paper will show that by applying the relevant statistical tools this mechanism can be controlled or even completely eliminated. Adjustment of plasma parameters will result in a process which yields excellent profile control.

Paper Details

Date Published: 23 April 1999
PDF: 6 pages
Proc. SPIE 3742, Process and Equipment Control in Microelectronic Manufacturing, (23 April 1999); doi: 10.1117/12.346245
Show Author Affiliations
Fred Smits, Motorola Ltd. (United Kingdom)


Published in SPIE Proceedings Vol. 3742:
Process and Equipment Control in Microelectronic Manufacturing
Kevin Yallup; Murali K. Narasimhan, Editor(s)

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