Share Email Print

Proceedings Paper

Characterization of inspection sensitivity on advanced OPC reticles
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The inspectability of advanced OPC plates has been verified by successfully completing inspections of photomasks that have OPC throughout the design. The photomasks tested have varying OPC design strategies and degrees of OPC complexity. The defect capture ability has been characterized with classical verification masks like the DuPont Verithoro, and OPC programmed defect test reticle called OPC3, and defect capture occurrences on actual design with advanced OPC features. Printability simulations and test have indicated that mis-sized serifs can be a critical, printable defect class. Inspection results from the 750 nm primary feature size section of the OPC3 test reticle with 0.25 micrometers pixel indicate better than 0.25 micrometers sensitivity to oversized serif defects, better than 0.30 micrometers sensitivity to undersized serifs, and better than 0.21 micrometers sensitivity to misplaced serif line ends. Historically, small defects on OPC structures such as mis-sized serifs could be easily misclassified as a false defect by inspection operators. Defect review software was upgraded to improve the visualization and sizing of defects on OPC structures.

Paper Details

Date Published: 23 April 1999
PDF: 5 pages
Proc. SPIE 3665, 15th European Conference on Mask Technology for Integrated Circuits and Microcomponents '98, (23 April 1999); doi: 10.1117/12.346219
Show Author Affiliations
Larry S. Zurbrick, KLA-Tencor Corp. (United States)
Joseph A. Straub, DuPont Photomasks, Inc. (United States)
Anthony Vacca, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 3665:
15th European Conference on Mask Technology for Integrated Circuits and Microcomponents '98
Uwe F. W. Behringer, Editor(s)

© SPIE. Terms of Use
Back to Top