Share Email Print
cover

Proceedings Paper

Future reticle demand and next-generation lithography technologies
Author(s): Uwe F. W. Behringer; Christian Ehrlich; Olaf Fortange
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Mask technology has often been considered an enabling for semiconductor fabrication. But today photomasks have evolved to a bottle neck in the every increasing integration process of semiconductor circuits. Regarding to the 1997 SIA roadmap there are very stringent requirements for mask making. Even with the momentary weak Asian market the worldwide demand for reticles will continue to grow. The anticipation of larger reticles has been discussed over years. What ever the reason for the need of larger reticles, the move to the 230 mm X 230 mm reticle size will provide size will provide unique challenges to both the mask equipment manufacturers and mask fabricator. Next Generation Lithography together with their mask techniques are in development and try to come into the market.

Paper Details

Date Published: 23 April 1999
PDF: 8 pages
Proc. SPIE 3665, 15th European Conference on Mask Technology for Integrated Circuits and Microcomponents '98, (23 April 1999); doi: 10.1117/12.346206
Show Author Affiliations
Uwe F. W. Behringer, Institute for Microstructure Technology/Forschungszentrum Karlsruhe GmbH (Germany)
Christian Ehrlich, Leica Microsystems Lithography GmbH (Germany)
Olaf Fortange, Leica Microsystems Lithography GmbH (Germany)


Published in SPIE Proceedings Vol. 3665:
15th European Conference on Mask Technology for Integrated Circuits and Microcomponents '98

© SPIE. Terms of Use
Back to Top