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Proceedings Paper

Surface-mount-type LD module
Author(s): Tsutomu Nakamura; Hajime Hotta; Tokihiro Terashima; Hiroshi Arimoto; Masanobu Kato
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Paper Abstract

An optical module is assembled using a passive-alignment technique. A laser diode (LD), a single mode fiber with a ferrule and a monitor photo diode (PD) are mounted on a silicon (Si) substrate. The LD and the PD are adjusted in three axis direction (horizontal axis, light axis and horizontal angle axis) to be die-bonded. The fiber is laid between a V-groove on the Si substrate and a glass block. In the perpendicular axis direction, the V-groove width is set so that the LD active layer and the fiber core are at the same height. The optical devices and the fiber facet are sealed using a thermosetting resin material. The Si substrate is bonded in a nonhermetic-sealed plastic package. The coupling losses of the LDs to the butt-jointed single mode fibers are estimated to be 7.4 to 10.8 dB, to the average value of 8.6 dB. The tracing errors of the fabricated modules are less than +/- 1.5 dB at ambient temperature from -40 to +85 degrees centigrade. The coupling losses change at the damp-heat stress test (85 degrees and 85% RH) is less than +/- 0.5 dB after more than 5,000 hours.

Paper Details

Date Published: 14 April 1999
PDF: 10 pages
Proc. SPIE 3626, Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV, (14 April 1999); doi: 10.1117/12.345425
Show Author Affiliations
Tsutomu Nakamura, Oki Electric Industry Co., Ltd. (Japan)
Hajime Hotta, Oki Electric Industry Co., Ltd. (Japan)
Tokihiro Terashima, Oki Electric Industry Co., Ltd. (Japan)
Hiroshi Arimoto, Oki Electric Industry Co., Ltd. (Japan)
Masanobu Kato, Oki Electric Industry Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 3626:
Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV
Mahmoud Fallahi; S. C. Wang; Mahmoud Fallahi; Kurt J. Linden; S. C. Wang, Editor(s)

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