Share Email Print
cover

Proceedings Paper

Overview of NECI projects on thin-cladding POF-based optical interconnects
Author(s): Yao Li
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We review recent progresses in various POF related optical interconnect projects at NEC Research Institute. These projects were initiated to study cost-effective sub-local optical interconnect solutions that can potentially compete with copper-based solutions in future. The projects include both coupling schemes for networking various POF data links, and point-to-point polymer circuits which can route data in both serial and parallel formats. Many of the mentioned projects are still on-going and thus the report here has the nature of progress update.

Paper Details

Date Published: 13 April 1999
PDF: 8 pages
Proc. SPIE 3632, Optoelectronic Interconnects VI, (13 April 1999); doi: 10.1117/12.344631
Show Author Affiliations
Yao Li, NEC Research Institute (United States)


Published in SPIE Proceedings Vol. 3632:
Optoelectronic Interconnects VI
Julian P. G. Bristow; Suning Tang, Editor(s)

© SPIE. Terms of Use
Back to Top