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Proceedings Paper

Optically interconnected static RAM for instruction-level parallel processors
Author(s): Dennis W. Prather; Michael L. Liccone; Marion R. LeCompte; Xiao Gao; Brian McMonagle; Richard Doyle; Paul Raymond Berger; Sean L. Rommel
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Paper Abstract

In this paper we introduce a micro-optical architecture that uses meso-scopic diffractive optical elements (DOEs) as 3D interconnects in a memory system for high level instruction level parallelism (ILP) processors. By using meso-scopic DOEs we can rescue the scale of integration to the VLSI scale, ie.e., the micron scale, achieve submicron alignment tolerance, improve reliability due to monolithic integration, facilitate integration into the current manufacturing infrastructure, and offer the ability for higher bandwidth and high interconnect densities. To this end we are developing the component technologies needed to realize this system. In this paper we present our work in the development of a theoretical and experimental framework for the design and characterization of meso-scopic DOEs, preliminary experimental results of meso-scopic beam splitters, and a large scale demonstration of the ILP memory system.

Paper Details

Date Published: 13 April 1999
PDF: 11 pages
Proc. SPIE 3632, Optoelectronic Interconnects VI, (13 April 1999); doi: 10.1117/12.344619
Show Author Affiliations
Dennis W. Prather, Univ. of Delaware (United States)
Michael L. Liccone, Univ. of Delaware (United States)
Marion R. LeCompte, Univ. of Delaware (United States)
Xiao Gao, Univ. of Delaware (United States)
Brian McMonagle, Univ. of Delaware (United States)
Richard Doyle, Univ. of Delaware (United States)
Paul Raymond Berger, Univ. of Delaware (United States)
Sean L. Rommel, Univ. of Delaware (United States)


Published in SPIE Proceedings Vol. 3632:
Optoelectronic Interconnects VI
Julian P. G. Bristow; Suning Tang, Editor(s)

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