Share Email Print
cover

Proceedings Paper

Packaging and testing high-speed electro-optic polymer modulators
Author(s): Yongqiang Shi; Wenshen Wang; David J. Olson; Weiping Lin; James H. Bechtel
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Electrooptic polymer modulators demonstrate ultra-high frequency response to 1 1 0 GHz at chip level. To interconnect these integrated polymer waveguide devices to fiber-optic networks and to fully use their ultra-wide bandwidth capacity, a packaging technology that includes optical interfaces to standard fibers, electrode transitions to wideband coaxial cable connectors, and a stable mechanical enclosure is required. This paper summarizes TACAN's efforts in high-speed electrooptic polymer modulator chip interfacing package. Fiber-to-waveguide pigtailing, mode mismatch loss reduction, and the optimization of extinction ratio are important considerations for optical interfaces. Due to materials limitations and the low driving voltage requirement, the waveguide mode size is often much smaller than that of a standard fiber which results in large mode mismatching loss. A fiber mode size conversion coupler has been developed to reduce the mode mismatching loss. For microwave interfaces, the emphasis is on the electrode to coaxial cable connector transitions that include the use of commercial components and the test of connectorized circuits. The packaged electrooptic modulators were tested for their performance characteristics. Connector-to-connector frequency response of the electrode circuits, analog and digital signal transmissions, long-term halfwave voltage stability, and DC bias stability have been tested using packaged electrooptic modulators.

Paper Details

Date Published: 13 April 1999
PDF: 10 pages
Proc. SPIE 3632, Optoelectronic Interconnects VI, (13 April 1999); doi: 10.1117/12.344602
Show Author Affiliations
Yongqiang Shi, TACAN Corp. (United States)
Wenshen Wang, TRW, Inc. (United States)
David J. Olson, TACAN Corp. (United States)
Weiping Lin, TACAN Corp. (United States)
James H. Bechtel, TACAN Corp. (United States)


Published in SPIE Proceedings Vol. 3632:
Optoelectronic Interconnects VI
Julian P. G. Bristow; Suning Tang, Editor(s)

© SPIE. Terms of Use
Back to Top