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Proceedings Paper

Progress in short-distance (0.5 m to 100 m) optical interconnects
Author(s): John A. Lehman; Julian P. G. Bristow; Yue Liu; Mary K. Hibbs-Brenner
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Paper Abstract

Short distance optical interconnects, which has long promised to solve a number of problems assumed to exist in electronic systems, seems to be at the threshold of providing real value to future processing systems. In many cases, it has been the cost of optical interconnects which has prevented their widespread adoption. However, while data rates required in future computing systems are increasing, and fiber optic component costs have decreased, the distances over which optical interconnects become attractive have been shrinking. In addition the increasing demand for smaller footprints for the I/O at the card edge, plays into one of the strong advantages unique to optics. An effort called Optical Micro-Networks is underway, funded by DARPA, whose objective is to demonstrate cost effective system level benefits in parallel optics for intra- and inter-rack interconnects by leveraging recent advances in VCSEL arrays, high sped CMOS, and low cost glass fiber cabling, connectors and on-board fiber routing. The approach will integrate optical interconnect functionality directly into an ASIC package thus reducing size, cost, and power.

Paper Details

Date Published: 13 April 1999
PDF: 10 pages
Proc. SPIE 3632, Optoelectronic Interconnects VI, (13 April 1999); doi: 10.1117/12.344593
Show Author Affiliations
John A. Lehman, Honeywell Technology Ctr. (United States)
Julian P. G. Bristow, Honeywell Technology Ctr. (United States)
Yue Liu, Honeywell Technology Ctr. (United States)
Mary K. Hibbs-Brenner, Honeywell Technology Ctr. (United States)


Published in SPIE Proceedings Vol. 3632:
Optoelectronic Interconnects VI
Julian P. G. Bristow; Suning Tang, Editor(s)

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