Share Email Print
cover

Proceedings Paper

Analysis of organic contaminants from silicon wafer and disk surfaces by thermal desorption-GC-MS
Author(s): Mark J. Camenzind; Latif Ahmed; Anurag Kumar
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Organic contaminants can affect semiconductor wafer processing including gate oxide integrity, polysilicon growth, deep ultraviolet photoresist line-width, and cleaning & etching steps. Organophosphates are known to counter dope silicon wafers. Organic contaminants in disk drives can cause failures due to stiction or buildup on the heads. Therefore, it is important to identify organic contaminants adsorbed on wafer or disk surfaces and find their sources so they can be either completely eliminated or at least controlled. Dynamic headspace TD-GC-MS (Thermal Desorption-Gas Chromatography-Mass Spectrometry) methods are very sensitive and can be used to identify organic contaminants on disks and wafers, in air, or outgassing from running drives or their individual components.

Paper Details

Date Published: 29 March 1999
PDF: 12 pages
Proc. SPIE 3619, Surface Characterization for Computer Disks, Wafers, and Flat Panel Displays, (29 March 1999); doi: 10.1117/12.343711
Show Author Affiliations
Mark J. Camenzind, Balazs Analytical Lab. (United States)
Latif Ahmed, Balazs Analytical Lab. (United States)
Anurag Kumar, Balazs Analytical Lab. (United States)


Published in SPIE Proceedings Vol. 3619:
Surface Characterization for Computer Disks, Wafers, and Flat Panel Displays
John C. Stover, Editor(s)

© SPIE. Terms of Use
Back to Top