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Proceedings Paper

Multiresolution approach to object classification using kinematic features
Author(s): Hai-Wen Chen; Harry A. Schmitt; Jack G. Riddle; Stephanie K. Mashima; Dennis M. Healy
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Paper Abstract

A multi-resolution approach to problems of the identification of classes of ballistic missile objects is outlined. This approach is based on the utilization of features estimated from time-varying infrared signatures and the subsequent discrimination of different objects using unique time-frequency patterns obtained from a multi- resolution decomposition of the training and observation (performance evaluation) data. For example, we have identified four features that show some promise for discrimination: the intensity in the second lowest sub-band, the temporal profile in the lowest frequency sub-band, the modulation intensity, and the DC level of each observed object. The multi-resolution discrimination algorithm's performance can be evaluated by comparing with more traditional Fourier based approaches. The multi-resolution discrimination algorithms were applied to simulated data and were shown, by using L1 or L2 norms as distance metrics, to provide good classification performance and to reduce the temporal data length by half. The features extracted using the discrete wavelet packet transform can help to further improve classification performance. The robustness of the algorithm in the presence of noise is also studied. All data sets were generated with Raytheon Missile Systems Company's high fidelity simulation.

Paper Details

Date Published: 22 March 1999
PDF: 11 pages
Proc. SPIE 3723, Wavelet Applications VI, (22 March 1999); doi: 10.1117/12.342948
Show Author Affiliations
Hai-Wen Chen, Raytheon Missile Systems Co. (United States)
Harry A. Schmitt, Raytheon Missile Systems Co. (United States)
Jack G. Riddle, Raytheon Missile Systems Co. (United States)
Stephanie K. Mashima, Raytheon Missile Systems Co. (United States)
Dennis M. Healy, DARPA (United States)

Published in SPIE Proceedings Vol. 3723:
Wavelet Applications VI
Harold H. Szu, Editor(s)

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