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Proceedings Paper

Measurement of surface profile of microstructure
Author(s): Mingbao Zhou; Linbo Bai; Zhan Li; HanMin Yao
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Paper Abstract

The paper describes the non-contact ultra-high accurate 3D surface profile measuring system for the microstructure, whose surface structure is probably deep and discontinuous. The system is based on the dual-path two-wavelength phase- shifting interferometry and data processing/analysis. To measure the deep microstructure,the generalized two- wavelength measuring method is adopted to expand the depth measuring range. To measure the microstructure whose surface is discontinuous, a new data analysis/processing method is presented, by which the discontinuous surface can be measured without the change of the measuring system. This system has already been applied to measure the surface profile of the various actual microstructures. The results show that the depth resolution of the system is 0.5nm, the depth measuring accuracy is better than 1.3nm. When 20X microscopic lenses is used, the transversal resolution of the system is about 0.5 micrometers , the field is about (phi) 1.325 mm.

Paper Details

Date Published: 10 March 1999
PDF: 7 pages
Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341284
Show Author Affiliations
Mingbao Zhou, Institute of Optics and Electronics (China)
Linbo Bai, Institute of Optics and Electronics (China)
Zhan Li, Institute of Optics and Electronics (China)
HanMin Yao, Institute of Optics and Electronics (China)


Published in SPIE Proceedings Vol. 3680:
Design, Test, and Microfabrication of MEMS and MOEMS
Bernard Courtois; Wolfgang Ehrfeld; Selden B. Crary; Wolfgang Ehrfeld; Hiroyuki Fujita; Jean Michel Karam; Karen W. Markus, Editor(s)

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