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Proceedings Paper

Extraction of compact models for MEMS/MOEMS package-device codesign
Author(s): Vladimir L. Rabinovich; Joost C.C. Van Kuijk; Susan Zhang; Stephen F. Bart; John R. Gilbert
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Paper Abstract

MEMS package requirements are by their nature application specific. MEMS devices are often inherently sensitive to stress induced by their packages sand often need direct access to the environment. Therefore, understanding the influence of packaging on MEMS is critical to a successful coupled package-device co-design. Here, an automated package-device interaction simulator has been developed. The simulator uses Finite Element Method models for both the package and the device analysis and ties the result of the simulations together through parametric models. This so- called Compact Model Extraction is an efficient way to solve complex problems. Several examples illustrate the use of this technique.

Paper Details

Date Published: 10 March 1999
PDF: 6 pages
Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341265
Show Author Affiliations
Vladimir L. Rabinovich, Microcosm Technologies, Inc. (United States)
Joost C.C. Van Kuijk, Microcosm Technologies B.V. (Netherlands)
Susan Zhang, Microcosm Technologies, Inc. (United States)
Stephen F. Bart, Microcosm Technologies, Inc. (United States)
John R. Gilbert, Microcosm Technologies, Inc. (United States)


Published in SPIE Proceedings Vol. 3680:
Design, Test, and Microfabrication of MEMS and MOEMS
Bernard Courtois; Wolfgang Ehrfeld; Selden B. Crary; Wolfgang Ehrfeld; Hiroyuki Fujita; Jean Michel Karam; Karen W. Markus, Editor(s)

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