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Proceedings Paper

Flip-chip integration of lenslet arrays on segmented deformable micromirrors
Author(s): Adisorn Tuantranont; Victor M. Bright; Wenge Zhang; Y. C. Lee
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Paper Abstract

Flip chip assembly technology offers a reliable and advanced packaging approach for hybrid integration of micromachined optical components. In this paper we present flip chip integration of microlens arrays with surface micromachined segmented deformable micromirrors. 12 by 12 electrostatic micromirror arrays were fabricated through a commercial surface micromachining process and integrated with glass microlenses. A commercial glass microlens array is positioned directly over the micromirror. The use of a lenslet to focus the incoming laser beam onto the reflective surface of a micromirror substantially increases optical efficiency of the hybrid microsystem. For mirror deflections much smaller than the lenslet focal length, the lenslet/micromirror combination behaves as a phase-only modulating optical element. The hybrid lenslet/MEMS arrays thus serve as rugged, compact optical elements for beam steering, beam shaping, and aberration correction applications.

Paper Details

Date Published: 10 March 1999
PDF: 11 pages
Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341259
Show Author Affiliations
Adisorn Tuantranont, Univ. of Colorado/Boulder (United States)
Victor M. Bright, Univ. of Colorado/Boulder (United States)
Wenge Zhang, Univ. of Colorado/Boulder (United States)
Y. C. Lee, Univ. of Colorado/Boulder (United States)


Published in SPIE Proceedings Vol. 3680:
Design, Test, and Microfabrication of MEMS and MOEMS
Bernard Courtois; Wolfgang Ehrfeld; Selden B. Crary; Wolfgang Ehrfeld; Hiroyuki Fujita; Jean Michel Karam; Karen W. Markus, Editor(s)

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