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Proceedings Paper

Micromachined photonic integrated circuits for sensor applications: experimental results
Author(s): Dana Cristea; Raluca Muller; Ioan Pavelescu
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Paper Abstract

The paper presents the integration ont he same chip of: Mach-Zehnder interferometers and Y junctions based on SiON waveguides, 3D movable micromechanical structures, optical couplers and photodetectors for optical read-out. The SiON low loss optical waveguides were fabricated by LPCVD processes, compatible with CMOS technology. The diaphragms, used for pressure sensing, obtained by p+ etch stop techniques, were placed under the sensing arm of the interferometer. The cantilevers, used in micromechanical resonators were manufactured by front side micromachining. The optical waveguides were coupled with different types of photodetectors, for optical read-out. Also experiments for hybrid integration of an emitting device have been performed. We used an AlGaAs emitting diode, with high edge emission, mounted in a silicon groove, on the same wafer with the sensor. The lateral emitted light is coupled in the waveguide. One of the main problems that had to be solved will be the matching of all the involved technologies. The result of our research is the demonstration of the compatibility between the technological process involved and the possibility of integration on the same silicon substrate of different components: waveguides, photodiodes, emitting devices, 3D movable microstructures in order to realize intelligent microsensors.

Paper Details

Date Published: 10 March 1999
PDF: 10 pages
Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341187
Show Author Affiliations
Dana Cristea, National Institute for Research and Development in Microtechnologies (Romania)
Raluca Muller, National Institute for Research and Development in Microtechnologies (Romania)
Ioan Pavelescu, National Institute for Research and Development in Microtechnologies (Romania)


Published in SPIE Proceedings Vol. 3680:
Design, Test, and Microfabrication of MEMS and MOEMS
Bernard Courtois; Wolfgang Ehrfeld; Selden B. Crary; Wolfgang Ehrfeld; Hiroyuki Fujita; Jean Michel Karam; Karen W. Markus, Editor(s)

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