Share Email Print
cover

Proceedings Paper

DEM technique: a new three-dimensional microfabrication technique for nonsilicon materials
Author(s): Di Chen; Dacheng Zhang; Guifu Ding; Xiaolin Zhao; Jilin Zhang; Cunsheng Yang; Bingchu Cai
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

DEM technique developed by present authors is a new 3D micro fabrication technique for non-silicon materials such as metals, plastics and ceramics. In comparison with LIGA technique, it does not need expensive synchrotron radiation source and x-ray masks. DEM technique has both advantages of bulk silicon micro fabrication technique and LIGA technique. In the present research, we obtained metallic mold insert with structure depth of 180 micrometers and aspect ratio more than 20. A successful development of DEm technique opens a new way for 3D micro fabrication of non-silicon materials.

Paper Details

Date Published: 10 March 1999
PDF: 6 pages
Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341181
Show Author Affiliations
Di Chen, Shanghai Jiao Tong Univ. (China)
Dacheng Zhang, Peking Univ. (China)
Guifu Ding, Shanghai Jiao Tong Univ. (China)
Xiaolin Zhao, Shanghai Jiao Tong Univ. (China)
Jilin Zhang, Shanghai Jiao Tong Univ. (China)
Cunsheng Yang, Shanghai Jiao Tong Univ. (China)
Bingchu Cai, Shanghai Jiao Tong Univ. (China)


Published in SPIE Proceedings Vol. 3680:
Design, Test, and Microfabrication of MEMS and MOEMS
Bernard Courtois; Wolfgang Ehrfeld; Selden B. Crary; Wolfgang Ehrfeld; Hiroyuki Fujita; Jean Michel Karam; Karen W. Markus, Editor(s)

© SPIE. Terms of Use
Back to Top